View BAS16LD_6965329.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. product profile 1.1 general description single high-speed switching diode, encapsul ated in a sod882d leadless ultra small surface-mounted device (smd) plastic pack age with visible and solderable side pads. 1.2 features and benefits 1.3 applications ? high-speed switching ? general-purpose switching 1.4 quick reference data [1] device mounted on an fr4 printed-circuit board (pcb) with 60 m copper strip line. [2] when switched from i f = 10 ma to i r =10ma; r l = 100 ; measured at i r =1ma. BAS16LD single high-speed switching diode rev. 1 ? 12 october 2010 product data sheet ? high switching speed: t rr 4ns ? low capacitance ? low leakage current ? reverse voltage: v r 100 v ? repetitive peak reverse voltage: v rrm 100 v ? ultra small and leadless smd plastic package ? aec-q101 qualified ? solderable side pads table 1. quick reference data symbol parameter conditions min typ max unit i f forward current [1] --215ma i r reverse current v r =80v - - 0.5 a v r reverse voltage - - 100 v t rr reverse recovery time [2] --4ns
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 2 of 11 nxp semiconductors BAS16LD single high-speed switching diode 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking [1] for sod882d binary marking code description, see figure 1 . 4.1 binary marking code description table 2. pinning pin description simplified outline graphic symbol 1 cathode [1] 2 anode transparent top view 2 1 006aab04 0 2 1 table 3. ordering information type number package name description version BAS16LD - leadless ultra small pl astic package; 2 terminals; body 1.0 0.6 0.4 mm sod882d table 4. marking codes type number marking code [1] BAS16LD 1000 0000 fig 1. sod882d binary marking code description vendor code marking code (example) cathode bar reading direction reading direction reading example: 0111 1011 006aac47 7
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 3 of 11 nxp semiconductors BAS16LD single high-speed switching diode 5. limiting values [1] device mounted on an fr4 pcb with 60 m copper strip line. [2] t j =25 c prior to surge. [3] reflow soldering is the only recommended soldering method. 6. thermal characteristics [1] device mounted on an fr4 pcb with 60 m copper strip line. [2] reflow soldering is the only recommended soldering method. table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v rrm repetitive peak reverse voltage -100v v r reverse voltage - 100 v i f forward current [1] 215 ma i frm repetitive peak forward current t p 0.5 s; ? 0.25 -500ma i fsm non-repetitive peak forward current square wave [2] t p =1 s-4a t p =1ms - 1 a t p =1s - 0.5 a p tot total power dissipation t amb 25 c [1] [3] -250mw t j junction temperature - 150 c t amb ambient temperature ? 55 +150 c t stg storage temperature ? 65 +150 c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] [2] - - 500 k/w
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 4 of 11 nxp semiconductors BAS16LD single high-speed switching diode 7. characteristics [1] pulse test: t p 300 s; ? 0.02. [2] when switched from i f = 10 ma to i r =10ma; r l = 100 ; measured at i r =1ma. [3] when switched from i f =10ma; t r =20ns. table 7. characteristics t amb =25 c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage [1] i f = 1 ma - - 715 mv i f = 10 ma - - 855 mv i f =50ma --1v i f =150ma --1.25v i r reverse current v r =25v --30na v r =80v --0.5 a v r =25v; t j =150 c --30 a v r =80v; t j =150 c --50 a c d diode capacitance f = 1 mhz; v r =0v --1.5pf t rr reverse recovery time [2] --4ns v fr forward recovery voltage [3] --1.75v
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 5 of 11 nxp semiconductors BAS16LD single high-speed switching diode (1) t amb = 150 c (2) t amb =85 c (3) t amb =25 c (4) t amb = ? 40 c based on square wave currents. t j =25 c; prior to surge fig 2. forward current as a function of forward voltage; typical values fig 3. non-repetitive peak forward current as a function of pulse duration; maximum values (1) t amb = 150 c (2) t amb =85 c (3) t amb =25 c (4) t amb = ? 40 c f=1mhz; t amb =25 c fig 4. reverse current as a function of reverse voltage; typical values fig 5. diode capacitance as a function of reverse voltage; typical values 006aab132 1 10 10 2 10 3 i f (ma) 10 ? 1 v f (v) 0 1.4 1.0 0.4 0.8 0.2 1.2 0.6 (1) (2) (3) (4) mbg704 10 1 10 2 i fsm (a) 10 ? 1 t p ( s) 110 4 10 3 10 10 2 006aab133 10 2 i r ( a) v r (v) 0 100 80 40 60 20 10 1 10 ? 1 10 ? 2 10 ? 3 10 ? 4 10 ? 5 (1) (2) (3) (4) 0816 12 4 0.8 0.6 0 0.4 0.2 mbg446 v r (v) c d (pf )
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 6 of 11 nxp semiconductors BAS16LD single high-speed switching diode 8. test information (1) i r =1ma input signal: reverse pulse rise time t r = 0.6 ns; reverse voltage pulse duration t p = 100 ns; duty cycle =0.05 oscilloscope: rise time t r =0.35ns fig 6. reverse recovery time test circuit and waveforms input signal: forward pulse rise time t r = 20 ns; forward current pulse duration t p 100 ns; duty cycle ? 0.005 fig 7. forward recovery voltage test circuit and waveforms t rr (1) + i f t output signal t r t p t 10 % 90 % v r input signal v = v r + i f r s r s = 50 i f d.u.t. r i = 50 sampling oscilloscope mga881 t r t t p 10 % 90 % i input signal r s = 50 i r i = 50 oscilloscope 1 k 450 d.u.t. mga88 2 v fr t output signal v
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 7 of 11 nxp semiconductors BAS16LD single high-speed switching diode 9. package outline 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . 11. soldering fig 8. package outline BAS16LD (sod882d) 10-08-06 dimensions in mm 0.65 0.30 0.22 0.30 0.22 0.55 0.45 0.65 0.55 0.4 max 1.05 0.95 2 cathode marking on top side 1 table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 10000 BAS16LD sod882d 2 mm pitch, 8 mm tape and reel -315 reflow soldering is the only recommended soldering method. fig 9. reflow soldering footprint BAS16LD (sod882d) solder lands solder resist solder paste sod882d_ fr dimensions in mm 1.4 0.2 0.3 0.4 1 1.3 0.8 (2 ) 0.6 (2 ) 0.7 (2 )
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 8 of 11 nxp semiconductors BAS16LD single high-speed switching diode 12. revision history table 9. revision history document id release date data sheet status change notice supersedes BAS16LD v.1 20101012 produ ct data sheet - -
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 9 of 11 nxp semiconductors BAS16LD single high-speed switching diode 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
BAS16LD all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 1 ? 12 october 2010 10 of 11 nxp semiconductors BAS16LD single high-speed switching diode quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BAS16LD single high-speed switching diode ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 12 october 2010 document identifier: BAS16LD please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4.1 binary marking code description. . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 packing information . . . . . . . . . . . . . . . . . . . . . 7 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 contact information. . . . . . . . . . . . . . . . . . . . . 10 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

▲Up To Search▲

Price & Availability of BAS16LD

	To Download BAS16LD Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .